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Considerations for Shell Heat Dissipation Design in Sheet Metal Processing
Published on:
2025-04-22
In sheet metal processing, the design of shell heat dissipation must consider thermodynamic principles and sheet metal process characteristics. It requires systematic design from four core dimensions: heat dissipation hole layout, airflow organization, structural protection, and material and process coordination. The following are specific considerations:
In sheet metal processing, the shell heat dissipation design must consider thermodynamic principles and sheet metal process characteristics, requiring systematic design from four core dimensions: heat dissipation hole layout, airflow organization, structural protection, and material-process coordination. The following are specific considerations:
1. Heat Dissipation Hole Layout: Balancing Efficiency and Protection
Position Selection
1. Proximity to Heat Source Principle: Heat dissipation holes should be preferentially arranged directly above or beside heat-generating components (such as CPU, power modules) to shorten the heat conduction path. For example, server chassis concentrate heat dissipation holes in the area corresponding to the CPU heat sink, which can reduce local temperature by 10%-15%.
2. Avoid Airflow Short Circuit: The intake and exhaust vents must maintain sufficient distance (recommended ≥ 1/3 of chassis height) to prevent hot air from being expelled before full circulation. If space is limited, airflow can be guided using baffles or ducts.
Size and Quantity Optimization
1. Open Area Ratio Control: The open area ratio (total area of heat dissipation holes / shell area) should be dynamically adjusted according to heat generation. Generally, electronic devices recommend an open area ratio of 15%-30%, while high-power devices (such as industrial power supplies) can increase to 40%-50%.
2. Hole Diameter and Spacing: Circular hole diameter is recommended to be ≤3mm (to prevent foreign object entry), with hole spacing ≥1.5 times the material thickness (to avoid mold breakage). For example, 1.2mm thick sheet metal uses φ2mm round holes with hole spacing ≥1.8mm.
3. Shape Selection: Slotted holes have high ventilation efficiency but require controlling the length-to-width ratio (recommended ≤5:1) to prevent structural strength reduction; honeycomb holes combine high strength and dust resistance but are more costly.
Protection Design
1. Dust Filtration: Install dust filters (such as nylon mesh, metal filters) at intake vents, with hole size selected according to protection level (IP5X requires ≤0.5mm).
2. Waterproof Treatment: Outdoor equipment should use slant-cut holes or louver structures combined with waterproof strips to ensure IP65 protection.
3. EMI Shielding: High-frequency devices should attach conductive foam or spray conductive paint inside heat dissipation holes to reduce electromagnetic leakage risk.
2. Airflow Organization: Improve Heat Dissipation Uniformity
Fan Selection and Layout
1. Matching Air Volume and Air Pressure: Calculate required air volume based on heat generation (Q=3600×P/ΔT×c×ρ), choosing axial fans (high air volume) or centrifugal fans (high air pressure). For example, a 100W device at ΔT=10℃ requires approximately 34m³/h air volume.
2. Positive Pressure Dust Prevention Design: Use an "exhaust" layout (fan located at exhaust vent) to create positive pressure inside the chassis, preventing dust from entering through gaps.
3. Redundancy Design: Key equipment is recommended to be equipped with dual fans and temperature-controlled speed adjustment functions (e.g., high-speed mode starts at 40℃).
Airflow Guide Structure
1. Application of Baffles: Install baffles behind fans to reduce airflow turbulence and improve heat dissipation efficiency by 5%-10%.
2. Air Duct Isolation: Use sheet metal partitions to divide the chassis into independent air ducts to avoid hot air recirculation. For example, using separate air ducts for GPU and CPU can reduce core temperature by 8℃.
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